At Global Interconnect, insulation materials such as FR4 or polyimide are selected depending on the application and envelope constraints. FR4 based boards provide a rigid foundation while polyimide based boards tend to be thin and flexible. A plated copper layer outlines the circuit traces and can be prepared for a variety of off-the-shelf electronics.
- Logic boards
- Small form factor
Custom PCBA and FPCs. Done right.
Time after time, our automated pick and place equipment populates our boards with precision. Depending on the component or application, electronics are attached to the boards by either skilled hand soldering and/or reflow ovens. What's more, automated equipment and/or manual inspection ensures all products produced meet IPC/WHMA manufacturing standards. Coatings such as parylene or low pressure molding provide additional environmental barriers while preventing damage to sensitive electronic components.
- Ingresses protection
- LED illumination
- Switch activation
- Raw board
- Functional logic
- Rated current
- Insulation resistance
- Contact resistance
- Dielectric strength
A headlight assembly needed to be low cost and fit within envelope constraints. We had the solution.
The initial headlight assembly design relied on rigid injection molds and required additional assembly after molding. That’s when we injected a better way of doing things.SEE CASE STUDY
We build quality into the entire process from the ground up by performing our own routine factory audits of our assembly partners and raw material suppliers. As an FDA registered ISO-13485 and ISO-9001 certified solutions provider, reliability is engineered into our products every step of the way.QUALITY CERTIFICATIONS